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Thermal Specifications
54 Thermal/Mechanical Specifications and Design Guidelines
6.1.7 Thermal Metrology
The maximum TTV case temperatures (T
CASE-MAX
) can be derived from the data in the
appropriate TTV thermal profile earlier in this chapter. The TTV T
CASE
is measured at the
geometric top center of the TTV integrated heat spreader (IHS). Figure 6-6 illustrates
the location where T
CASE
temperature measurements should be made. See Figure B-17
for drawing showing the thermocouple attach to the TTV package.
Note: The following supplier can machine the groove and attach a thermocouple to the IHS.
The supplier is listed below as a convenience to Intel’s general customers and the list
may be subject to change without notice. THERM-X OF CALIFORNIA Inc, 3200
Investment Blvd., Hayward, Ca 94545. Ernesto B Valencia +1-510-441-7566 Ext. 242
ernestov@therm-x.com. The vendor part number is XTMS1565.
6.2 Processor Thermal Features
6.2.1 Processor Temperature
A new feature in the processors is a software readable field in the
IA32_TEMPERATURE_TARGET register that contains the minimum temperature at
which the TCC will be activated and PROCHOT# will be asserted. The TCC activation
temperature is calibrated on a part-by-part basis and normal factory variation may
result in the actual TCC activation temperature being higher than the value listed in the
register. TCC activation temperatures may change based on processor stepping,
frequency or manufacturing efficiencies.
6.2.2 Adaptive Thermal Monitor
The Adaptive Thermal Monitor feature provides an enhanced method for controlling the
processor temperature when the processor silicon exceeds the Thermal Control Circuit
(TCC) activation temperature. Adaptive Thermal Monitor uses TCC activation to reduce
processor power via a combination of methods. The first method (Frequency/VID
Figure 6-6. TTV Case Temperature (T
CASE
) Measurement Location
37.5
37.5
Measure T
CASE
at
the geometric
center of the
package