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LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
40 Thermal/Mechanical Specifications and Design Guidelines
A detailed description of this methodology can be found at: ftp://download.intel.com/
technology/itj/q32000/pdf/reliability.pdf.
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Figure 5-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology
Establish the
market/expected use
environment for the
technology
Develop Speculative
stress conditions based on
historical data, content
experts, and literature
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Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors
Freeze stressing
requirements and perform
additional data turns