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Active Tower Thermal Solution
84 Thermal/Mechanical Specifications and Design Guidelines
10.2 Mechanical Specifications
10.2.1 Cooling Solution Dimensions
This section documents the mechanical specifications. Figure 10-1 shows a mechanical
representation of the solution.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the processor with
assembled thermal solution are shown in Figure 10-2 (Side View), and Figure 10-3
(Top View). The airspace requirements for this active tower heatsink must also be
incorporated into new baseboard and system designs. Note that some figures have
centerlines shown (marked with alphabetic designations) to clarify relative
dimensioning.
Figure 10-2. Physical Space Requirements for the Solution (side view)