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Thermal/Mechanical Specifications and Design Guideline 5
11 Thermal Solution Quality and Reliability Requirements............................................ 89
11.1 Reference Heatsink Thermal Verification............................................................... 89
11.2 Mechanical Environmental Testing ....................................................................... 89
11.2.1 Recommended Test Sequence.................................................................. 90
11.2.2 Post-Test Pass Criteria ............................................................................ 90
11.2.3 Recommended BIOS/Processor/Memory Test Procedures............................. 90
11.3 Material and Recycling Requirements ................................................................... 91
A Component Suppliers............................................................................................... 93
B Mechanical Drawings............................................................................................... 95
C Socket Mechanical Drawings ................................................................................. 115
D Package Mechanical Drawings ............................................................................... 121
Figures
2-1 Processor Package Assembly Sketch .................................................................... 13
2-2 Package View ................................................................................................... 14
2-3 Processor Top-Side Markings .............................................................................. 16
2-4 Processor Package Lands Coordinates .................................................................. 17
3-1 LGA1155 Socket with Pick and Place Cover ........................................................... 19
3-2 LGA1155 Socket Contact Numbering (Top View of Socket)...................................... 20
3-3 LGA1155 Socket Land Pattern (Top View of Board) ................................................ 21
3-4 Suggested Board Marking................................................................................... 22
3-5 Attachment to Motherboard ................................................................................ 22
3-6 Pick and Place Cover.......................................................................................... 24
3-7 Package Installation / Removal Features............................................................... 25
4-1 ILM Assembly with Installed Processor ................................................................. 28
4-2 Back Plate........................................................................................................ 29
4-3 Shoulder Screw................................................................................................. 30
4-4 ILM Assembly ................................................................................................... 31
4-5 Pin1 and ILM Lever............................................................................................ 32
4-6 ILM Cover ........................................................................................................ 34
4-7 ILM Cover and PnP Cover Interference ................................................................. 35
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .......................... 40
6-1 Thermal Test Vehicle Thermal Profile for Intel
®
Xeon
®
Processor E3-1280 (95W) ....... 43
6-2 Thermal Test Vehicle Thermal Profile for Intel
®
Xeon
®
Processor E3-1200 (80W) ....... 44
6-3 Thermal Test Vehicle Thermal Profile for Intel
®
Xeon
®
Processor E3-1260L (45W) ..... 46
6-4 Thermal Test Vehicle Thermal Profile for Intel
®
Xeon
®
Processor E3-1220L (20W) .... 47
6-5 Thermal Test Vehicle Thermal Profile for
Intel
®
Xeon
®
Processor E3-1200 (95W) with Integrated Graphics ............................ 48
6-6 TTV Case Temperature (TCASE) Measurement Location.......................................... 54
6-7 Frequency and Voltage Ordering.......................................................................... 56
6-8 Package Power Control....................................................................................... 61
8-1 Comparison of Case Temperature vs. Sensor Based Specification............................. 66
8-2 Intel
®
Xeon
®
Processor E3-1280 (95W) TTV Thermal Profile ................................. 67
8-3 DTS 1.1 Definition Points.................................................................................... 72
9-1 1U Collaboration Heatsink Performance Curves...................................................... 76
9-2 1U Collaboration Heatsink Performance Curves...................................................... 77
9-3 1U Collaboration Heatsink Assembly .................................................................... 79
9-4 1U Reference Heatsink Performance Curves .......................................................... 80
9-5 KOZ 3-D Model (Top) in 1U Server ...................................................................... 81
9-6 TTV Die Size and Orientation .............................................................................. 82