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1U Thermal Solution
9.2.3 Assembly
The assembly process for the 1U collaboration heatsink with application of thermal
interface material begins with placing back plate in a fixture. The motherboard is
aligned with fixture.
Next is to place the heatsink such that the heatsink fins are parallel to system airflow.
While lowering the heatsink onto the IHS, align the four captive screws of the heatsink
to the four holes of motherboard.
Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds.
This assembly process is designed to produce a static load compliant with the minimum
preload requirement (26.7 lbf) for the selected TIM and to not exceed the package
design limit (50 lbf).
Figure 9-3. 1U Collaboration Heatsink Assembly