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1U Thermal Solution
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9.2.2 Thermal Solution
The collaboration thermal solution consists of two assemblies: heatsink assembly &
back plate.
Heatsink is designed with the Aluminum base and Aluminum stack fin, which
volumetrically is 95x95x24.85 mm. The heatpipe technology is used in the heatsink to
improve thermal conduction.
Heatsink back plate is a 1.8 mm thick flat steel plate with threaded studs for heatsink
attach. A clearance hole is located at the center of the heatsink backplate to
accommodate the ILM back plate. An insulator is pre-applied.
Note: Heatsink back plate herein is only applicable to 1U server. Desktop has a specific
heatsink back plate for its form factor.
36
55.9
51.5 86
70.9
67.4
38
56.5
52.1 88
71.5
68.1
40
57.1
52.8 90
72.1
68.7
42
57.7
53.4 92
72.7
69.3
44
58.3
54.0 94
73.3
70.0
46
58.9
54.7 95
73.6
70.3
48
59.5
55.3
Table 9-2. Comparison between TTV Thermal Profile and Thermal Solution Performance
for Intel
®
Xeon
®
Processor E3-1280 (95W) (Sheet 2 of 2)
Power (W)
TTV T
CASE_MAX
(°C)
Thermal
Solution
T
CASE_MAX
(°C)
Power (W)
TTV T
CASE_MAX
(°C)
Thermal
Solution
T
CASE_MAX
(°C)