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Thermal/Mechanical Specifications and Design Guidelines 9
Introduction
1 Introduction
This document is intended to provide guidelines for design of thermal and mechanical
solution. Meanwhile thermal and mechanical specifications for the processor and
associated socket are included.
The components described in this document include:
• The thermal and mechanical specifications for the following Intel
®
server/
workstation processors:
—Intel
®
Xeon
®
processor E3-1200 product family
• The LGA1155 socket and the Independent Loading Mechanism (ILM) and back
plate.
• The collaboration/reference design thermal solution (heatsink) for the processors
and associated retention hardware.
The Intel
®
Xeon
®
Processor E3-1200 product family has the different thermal
specifications. When required for clarity this document will use:
•Intel
®
Xeon
®
processor E3-1280 (95W)
•Intel
®
Xeon
®
processor E3-1200 (80W)
•Intel
®
Xeon
®
processor E3-1200 series (95W) with integrated graphics
•Intel
®
Xeon
®
processor E3-1260L (45W)
•Intel
®
Xeon
®
processor E3-1220L (20W)
Note: When the information is applicable to all products the this document will use
“processor” or “processors” to simplify the document.