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4 Thermal/Mechanical Specifications and Design Guideline
6.1.4 Intel
®
Xeon
®
Processor E3-1220L (20W) Thermal Profile..............................47
6.1.5 Intel
®
Xeon
®
Processor E3-1200 (95W) with Integrated
Graphics Thermal Profile..........................................................................48
6.1.6 Processor Specification for Operation Where Digital Thermal
Sensor Exceeds TCONTROL......................................................................49
6.1.7 Thermal Metrology..................................................................................54
6.2 Processor Thermal Features ................................................................................54
6.2.1 Processor Temperature............................................................................54
6.2.2 Adaptive Thermal Monitor ........................................................................54
6.2.3 THERMTRIP# Signal................................................................................58
6.3 Intel
®
Turbo Boost Technology............................................................................58
6.3.1 Intel
®
Turbo Boost Technology Frequency..................................................58
6.3.2 Intel
®
Turbo Boost Technology Graphics Frequency.....................................59
6.4 Thermal Considerations ......................................................................................59
6.4.1 Intel
®
Turbo Boost Technology Power Control and Reporting ........................60
6.4.2 Package Power Control ............................................................................61
6.4.3 Power Plane Control................................................................................61
6.4.4 Turbo Time Parameter.............................................................................61
7 PECI Interface .........................................................................................................63
7.1 Platform Environment Control Interface (PECI) ......................................................63
7.1.1 Introduction...........................................................................................63
8 Sensor Based Thermal Specification Design Guidance ..............................................65
8.1 Sensor Based Specification Overview (DTS 1.0) .....................................................65
8.2 Sensor Based Thermal Specification .....................................................................67
8.2.1 TTV Thermal Profile.................................................................................67
8.2.2 Specification When DTS value is Greater than TCONTROL.............................68
8.3 Thermal Solution Design Process .........................................................................68
8.3.1 Boundary Condition Definition ..................................................................68
8.3.2 Thermal Design and Modelling ..................................................................69
8.3.3 Thermal Solution Validation......................................................................69
8.4 Fan Speed Control (FSC) Design Process...............................................................69
8.4.1 DTS 1.1 A New Fan Speed Control Algorithm without TAMBIENT Data............71
8.5 System Validation..............................................................................................73
9 1U Thermal Solution ................................................................................................75
9.1 Performance Targets ..........................................................................................75
9.2 1U Collaboration Heatsink...................................................................................75
9.2.1 Heatsink Performance .............................................................................75
9.2.2 Thermal Solution ....................................................................................78
9.2.3 Assembly...............................................................................................79
9.3 1U Reference Heatsink .......................................................................................80
9.3.1 Heatsink Performance .............................................................................80
9.3.2 Thermal Solution ....................................................................................80
9.3.3 Assembly...............................................................................................81
9.4 Geometric Envelope for 1U Thermal Mechanical Design...........................................81
9.5 Thermal Interface Material ..................................................................................81
9.6 Heat Pipe Thermal Consideration .........................................................................81
10 Active Tower Thermal Solution ................................................................................83
10.1 Introduction......................................................................................................83
10.2 Mechanical Specifications....................................................................................84
10.2.1 Cooling Solution Dimensions ....................................................................84
10.2.2 Retention Mechanism and Heatsink Attach Clip Assembly .............................85
10.3 Electrical Requirements ......................................................................................85
10.3.1 Active Tower Heatsink Power Supply .........................................................85
10.4 Cooling Requirements ........................................................................................87