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Thermal/Mechanical Specifications and Design Guidelines 99
Mechanical Drawings
Figure B-4. Socket / Processor / ILM Keepout Zone Secondary Side for 1U (Bottom)
SIZE DRAWING NUMBER REV
A1 E21320 J
SCALE: NONE
DO NOT SCALE DRAWING
SHEET 2 OF 2
0.1 B C
25.81
18.00
0.00
0.00
18.00
3X
NO ROUTE ON
PRIMARY & SECONDARY SIDES
3 X 4.70 NO ROUTE ON
ALL OTHER LAYERS
COPPER PAD ON PRIMARY SIDE,
NON-GROUNDED.
COPPER PAD CAN INSET MAXIMUM
OF .127MM FROM THE NO ROUTE EDGE
6.00
+0.05
-0.03
3X NPTH
3.80
+0.05
-0.03
()11.78
8.00
3.50
17.00
()18.12
10.97
3.50
()6.30
35.21
25.50
40.71
25.70
0.00
25.70
23.81
0.00
37.31
R3.50
B
C
B
C
()15.83
()13.75
()10.50
()47.50
TOP SIDE VIEW
TOP SIDE
PCB ILM MOUNTING HOLES
TOP SIDE
PCB ILM SILKSCREEN
DETAIL A
5 FINGER ACCESS
COMPONENT KEEPOUT
AREA
PIN 1
LEVER UNLATCHED
ADD SILKSCREEN OUTLINE
ON PCB PRIMARY SIDE
AS SHOWN