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1U Thermal Solution
9.3.3 Assembly
The assembly process is same as the way described in Section 9.2.3, please refer to it
for more details.
9.4 Geometric Envelope for 1U Thermal Mechanical
Design
9.5 Thermal Interface Material
A thermal interface material (TIM) provides conductivity between the IHS and heatsink.
The collaboration thermal solution uses Honeywell PCM45F, which pad size is
35x35 mm.
TIM should be verified to be within its recommended shelf life before use. Surfaces
should be free of foreign materials prior to application of TIM.
9.6 Heat Pipe Thermal Consideration
The following drawing shows the orientation and position of the 1155-land LGA Package
TTV die, this is the same package layout as used in the 1156-land LGA Package TTV.
The TTV die is sized and positioned similar to the production die.
Figure 9-5. KOZ 3-D Model (Top) in 1U Server
2.5mm Maximum
Component Height
(6 places)
1.2mm Maximum
Component Height
(1 place)
1.6mm Maximum
Component Height
(2 places)
9.5mm Maximum
Component Height
(5 places)
2.07mm Maximum
Component Height
(1 place)