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1U Thermal Solution
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9.3 1U Reference Heatsink
9.3.1 Heatsink Performance
For 1U reference heatsink, see Appendix B for detailed drawings. Figure 9-4 shows
Ψ
CA
and pressure drop for the 1U reference heatsink versus the airflow provided. Best-
fit equations are provided to prevent errors associated with reading the graph.
This 1U Reference thermal solution Ψca(mean+3sigma) is computed to 0.353°C/W at
the airflow of 15.5 CFM, which just meets Intel
®
Xeon
®
processor E3-1280 (95W) TTV
thermal profile specification when T
LA
is 40 °C.
9.3.2 Thermal Solution
The reference thermal solution consists of two assemblies: heatsink assembly & back
plate.
Heatsink is designed with extruded Aluminum, which volumetrically is 95x95x24.85
mm with total 43 fins. Please refer to Appendix B for detailed drawings.
Heatsink back plate is a 1.8 mm thick flat steel plate with threaded studs for heatsink
attach. A clearance hole is located at the center of the heatsink backplate to
accommodate the ILM back plate. An insulator is pre-applied.
Note: Heatsink back plate herein is only applicable to 1U server. Desktop has a specific
heatsink back plate for its form factor.
Figure 9-4. 1U Reference Heatsink Performance Curves