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98 Thermal/Mechanical Specifications and Design Guidelines
Figure B-3. Socket / Processor / ILM Keepout Zone Primary Side for 1U (Top)
A
A
B
B
DEPARTMENT
R
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PST-TMI
TITLE
LGA1156 & 1155 SOCKET,
ILM & PROCESSOR KEEPIN
SIZE DRAWING NUMBER REV
A1
E21320
J
SCALE: 1.000
DO NOT SCALE DRAWING
SHEET 1 OF 2
51.00
70.37
17.00
7170.0
()15.16
8.12
49.50
3.75
11.75
9.26
9.26
8.97
8.97
6.55
3X 6.34
6.76
6.76
1.25
13.00
5.50
40.71
37.54
()78.25
CLEARANCE NEEDED
FOR WIRE TRAVEL
3.75
4.00
8130.0
618.72
6
27.33
3.18
3.18
15.92
19.50
()42.50
()42.50
4.00
1.75
7.00
()
TYP PCB THICKNESS
1.50
2.50
()49.50
2.50
28.12
42.50
21.25
()94.76
78.25
3X 2.58
3X 5.00
12.29
19.99
B
C
C
B
B
C
C
(R )65.21
(R )46.51
()37.54
()2.50
()1.50
NOTES:
1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC
CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNS
WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS).
2 SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET
AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION.
IT ENCOMPASSES SOCKET AND CPU PACKAGE DIMENSIONAL TOLERANCES
AND DEFLECTION / SHAPE CHANGES DUE TO ILM LOAD.
3. SOCKET KEEP-IN VOLUME ENCOMPASS THE SOCKET NOMINAL VOLUME
AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT
DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET KEEP IN VOLUME WITH
CLEARANCE MARGINS. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME.
4.DIMENSIONS ARE IN MILLIMETERS
5 NO COMPONENT BOUNDARY-FINGER ACCESS AREA
6 MOTHERBOARD BACKSIDE COMPONENT KEEP-IN
7 MAXIMUM OPEN ANGLE TO OPEN LOAD PLATE
8 MINIMUM OPEN ANGLE TO CLEAR LOAD PLATE
TOP SIDE
BOTTOM SIDE
1
2
SECTION A-A
SECTION B-B
SEE DETAIL A
5
MAX LEVER MOTION SPACE
TO LEVER STOP
7
LOAD PLATE OPENING
MOTION SPACE
MIN LEVER MOTION SPACE
TO OPEN LID
8
PRIMARY SIDE COMPONENT
CLEARANCE
LEVER UNLATCHED
POSITION
SECONDARY SIDE
COMPONENT CLEARANCE
SEE DETAIL A