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Attention: Do not touch the thermal material on the bottom of the heat sink. Touching the thermal
material will contaminate it. If the thermal material on the microprocessor or heat sink becomes
contaminated, contact your service technician.
a. Make sure that the thermal material is still on the bottom of the heat sink; then, align the heat
sink so that the arrows on the label point toward the DIMMs and place the heat sink on top of the
microprocessor, thermal material side down.
b. Align the screw holes 1 on the heat sink with the holes on the system board 3 Following is an
illustration of the heat sink orientation.
Heatsink
Orientation
DIMMs
DIMMs
c. Tighten the screws with a screwdriver, alternating among the screws until they are tight. If possible,
each screw should be rotated two full rotations at a time. Repeat until the screws are tight. Do not
overtighten the screws by using excessive force.
6. Go to “Completing the FRU replacement” on page 172.
Thermal grease
The thermal grease must be replaced whenever the heat sink has been removed from the top of the
microprocessor and is going to be reused or when debris is found in the grease.
When you are installing the heat sink on the same microprocessor that is was removed from, make sure
that the following requirements are met:
• The thermal grease on the heat sink and microprocessor is not contaminated.
• Additional thermal grease is not added to the existing thermal grease on the heat sink and microprocessor.
142 Hardware Maintenance Manual