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EM78P259N/260N
8-Bit Microprocessor with OTP ROM
Product Specification (V1.2) 05.18.2007
• 83
(This specification is subject to change without further notice)
C Quality Assurance and Reliability
Test Category Test Conditions Remarks
Solderability
Solder temperature=245±5
°
C, for 5 seconds up to the
stopper using a rosin-type flux
Step 1: TCT, 65
°
C (15mins)~150
°
C (15mins), 10 cycles
Step 2: Bake at 125
°
C, TD (durance)=24 hrs
Step 3: Soak at 30°C/60%，TD (durance)=192 hrs
Pre-condition
Step 4: IR flow 3 cycles
(Pkg thickness ≥ 2.5mm or
Pkg volume ≥ 350mm3 ----225±5
°
C)
(Pkg thickness ≤ 2.5mm or
Pkg volume ≤ 350mm3 ----240±5
°
C )
For SMD IC (such as
SOP, QFP, SOJ, etc)
Temperature cycle test -65℃ (15mins)~150
°
C (15mins), 200 cycles
Pressure cooker test
TA =121
°
C, RH=100%, pressure=2 atm,
TD (durance)= 96 hrs
High temperature /
High humidity test
TA=85
°
C , RH=85%，TD (durance)=168 , 500 hrs
High-temperature
storage life
TA=150
°
C, TD (durance)=500, 1000 hrs
High-temperature
operating life
TA=125
°
C, VCC=Max. operating voltage,
TD (durance) =168, 500, 1000 hrs
Latch-up TA=25
°
C, VCC=Max. operating voltage, 150mA/20V
ESD (HBM) TA=25
°
C, ≥∣± 3KV∣
ESD (MM) TA=25℃, ≥∣± 300V∣
IP_ND,OP_ND,IO_ND
IP_NS,OP_NS,IO_NS
IP_PD,OP_PD,IO_PD,
IP_PS,OP_PS,IO_PS,
VDD-VSS(+),VDD_VSS
(-)mode
C.1 Address Trap Detect
An address trap detect is one of the MCU embedded fail-safe functions that detects
MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an
instruction from a certain section of ROM, an internal recovery circuit is auto started. If
a noise caused address error is detected, the MCU will repeat execution of the program
until the noise is eliminated. The MCU will then continue to execute the next program.