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Intel
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IXF1104 4-Port Gigabit Ethernet Media Access Controller
229 Datasheet
Document Number: 278757
Revision Number: 009
Revision Date: 27-Oct-2005
9.3.3 Top Label Marking Example
Figure 59 shows the IXF1104 MAC non-RoHS-compliant device marking label.
Note: In contrast to the Pb-Free (RoHS-compliant) package, the non-RoHS-compliant package does not
have the “e1” symbol.
Figure 59. Package Marking Example
Character Font
Size
0.04
-
0.10”
0.06 - 0.10”
25.0 mm
7.5 x 7.5 mm
25.0 mm
P
in 1 mark
AAA000AAA
= Intel Product Number
0.19 - 0.24”
®
0.07 - 0.12”
R
NOTE: * "Pin 1 " does mean a Pin1 indicator, not an actual mark.
Country
XX
= Intel Silicon revision number, A0, A1, B0 …
Note: Diameter of Trademark Circles are 70 mils.
Height of circles surrounding Pb-redced symbol are
equal to overall character height
Substrate PN
= Substrate material number (barely visible)
JJJJJJJJ
= Manufacturing Lot Number
Syww9001
= Intel Finished Process Order (FPO) numbe
r
Country
= Assy plant Country of Origin
Topside fields not to scale
Diameter of Pin 1 mark is 70 mils,
and is located opposite the top-side
substrate “Pin 1” identifier.
QQ
= Quality Level, P: Proto Type, PQ: Potential Qual’able,
“ ”: Production (no marking)
++
++
= Rework Indicator
Syww9001
Back of the die
(Bare Silicon)
Substrate PN
e1e1
= Pb-Reduced indicator (Same as Jedec)
B5131-01
NOTE: The actual product name marking is IXF1104CE, not HFIXF1104CE (leaded version) and
WFIXF1104CE (Pb-reduced), due to lidless package space limitation.