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Thermal Data (Preliminary)
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E
December 2, 2008, Preliminary Document Classification: Proprietary Information Page 129
9 Thermal Data (Preliminary)
Table 72 provides the package thermal data for the device. This data is derived from simulations that
were run according to the JEDEC standard.
The documents listed below provide a basic understanding of thermal management of integrated
circuits (ICs) and guidelines to ensure optimal operating conditions for Marvell products. Before
designing a system it is recommended to refer to these documents:
Application Note, AN-63 Thermal Management for Selected Marvell® Products, Document
Number MV-S300281-00
White Paper, ThetaJC, ThetaJA, and Temperature Calculations, Document Number
MV-S700019-00.
Note
TET
The thermal parameters are preliminary and subject to change.
Table 72: Thermal Data for the 88F6281 in the BGA 19 x 19 mm Package (Preliminary)
Symbol Definition Airflow Value (C/W)
0[m/s] 1[m/s] 2[m/s]
θ
JA
Thermal resistance: junction to ambient. 20.2 18.7 18.1
Ψ
JT
Thermal characterization parameter:
junction to case center.
7.0 7.0 7.1
θ
JC
Thermal resistance: junction to case (not air-flow dependent) 8.4
Ψ
JB
Thermal characterization parameter:
junction to the bottom of the package.
10.7 10.6 10.6
θ
JB
Thermal resistance:
junction to the bottom of the package (not air-flow dependent)
10.9