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Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E
December 2, 2008, Preliminary Document Classification: Proprietary Information Page 131
Table 73: HSBGA 288-pin Package Dimensions
Symbol Common Dimension
(in millimeters)
Package HSBGA
Body size
X D 19.000
Y E 19.000
Ball pitch
XeD 1.000
YeE 1.000
Total thickness A 1.910 ± 0.190
Mold thickness A3 0.850 ref
Substrate thickness A2 0.560 ref
Ball diameter 0.600
Standoff A1 0.400 ~ 0.600
Ball width b 0.500 ~ 0.700
Mold area
X M 17.000
Y N 17.000
H/S exposed size P 12.000 ~ 13.200
H/S flatness Q 0.100
H/S shift with substrate edge R 0.300
H/S shift with mold area S 0.500
Chamfer CA 1.215 ref
Package edge tolerance aaa 0.200
Substrate flatness bbb 0.250
Mold flatness ccc 0.350
Copolarity ddd 0.200
Ball offset (package) eee 0.250
Ball offset (ball) fff 0.100
Ball count n 288
Edge ball center-to-center
X D1 17.000
Y E1 17.000