Texas Instruments TMS320DM643 Computer Hardware User Manual


 
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2.3SignalDescriptions
DDR_D[31:0]
DDR2
memory
controller
DDR_CLK
DDR_CLK
DDR_CS
DDR_CKE
DDR_RAS
DDR_WE
DDR_DQM[3:0]
DDR_CAS
DDR_BA[2:0]
DDR_DQS[3:0]
DDR_A[12:0]
DDR_ZN
DDR_ZP
200
200
PeripheralArchitecture
TheDDR2memorycontrollersignalsareshowninFigure3anddescribedinTable2.Thefollowing
featuresareincluded:
Themaximumdatabusis32-bitswide.
Theaddressbusis13-bitswidewithanadditional3bankaddresspins.
Twodifferentialoutputclocksdrivenbyinternalclocksources.
Commandsignals:Rowandcolumnaddressstrobe,writeenablestrobe,datastrobe,anddatamask.
Onechipselectsignalandoneclockenablesignal.
Figure3.DDR2MemoryControllerSignals
Table2.DDR2MemoryControllerSignalDescriptions
PinTypeDescription
DDR_CLK,O/ZClock:Differentialclockoutputs.
DDR_CLK
DDR_CKEO/ZClockenable:Activehigh.
DDR_CSO/ZChipselect:Activelow.
DDR_WEO/ZWriteenablestrobe:Activelow,commandoutput.
DDR_RASO/ZRowaddressstrobe:Activelow,commandoutput.
DDR_CASO/ZColumnaddressstrobe:Activelow,commandoutput.
DDR_DQM[3:0]O/ZDatamask:Outputmasksignalforwritedata.
DDR_DQS[3:0]I/O/ZDatastrobe:Activehigh,bi-directionalsignals.Outputwithwritedata,inputwithreaddata.
DDR_BA[2:0]O/ZBankaddress:Output,definingwhichbankagivencommandisapplied.
DDR_A[12:0]O/ZAddress:Addressbus.
DDR_D[31:0]I/O/ZData:Bi-directionaldatabus.Inputforreaddata,outputforwritedata.
DDR_ZN,OOutputimpedancecontrol:RequiredtosettheDDR2outputimpedance.Connectedbywayof
DDR_ZPa200-ohmresistortopowerandground(seeFigure3).Theresistorshouldbechosentobe
4timesthedesiredimpedanceoftheoutputbuffer.Bychangingthesizeoftheresistor,the
DDR2outputscanbetunedtomatchtheboardload,ifnecessary.
SPRU986BNovember2007DDR2MemoryController11
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