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Intel
®
IXP43X Product Line of Network Processors
April 2007 HDG
Document Number: 316844; Revision: 001US 59
Hardware Design Guidelines—Intel
®
IXP43X Product Line of Network Processors
• Fast and slow transmission line networks must be considered
•PCB-board velocities
•Board FR4 ~ 4.3
• Target impedance of 50 Ω ± 10%
• Trace width: 5 mils
• Signal Layers (1/2 oz. Copper)
• Power Layer (1 oz. Copper)
• Ground (GND) Layer (1 oz. Copper)
§ §
Figure 17. 8-Layer Stackup
Figure 18. 6-Layer Stackup
B2244-02
Data
Data
Data
Data
SIGNAL
GND
Data
Data
4.5 mil
5 mil
5 mil
7 mil
4.5 mil
7 mil
62 mil
17.8 mil
Component (Top) Side
Solder (Bottom) Side
L1
L2
L3
L4
L5
L6
L7
L8
Legend
POWER
B2275-02
SIGNAL
GND
POWER
4.5 mil
7 mil
62 mil
~40 mil
Legend
7 mil
4.5 mil
L1
L2
L3
L4
L5
L6
Component (Top) Side
Solder (Bottom) Side