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Pinout Descriptions
DS610-4 (v2.0) July 16, 2007 www.xilinx.com 95
Product Specification
R
Footprint Migration Differences
There are multiple migration footprint differences between
the XC3SD1800A and the XC3SD3400A in the FG676
package. These migration footprint differences are shown in
Table 67. Migration from the XC3S1400A Spartan-3A
device in the FG676 package to a Spartan-3A DSP device
in the FG676 package is also possible. The XC3S1800A pin
migration differences have been added to Ta bl e 67 for
designs migrating between these devices.
Table 67:
FG676 Footprint Migration Differences
Spartan-3A Spartan-3A DSP Spartan-3A DSP
FG676
Ball
XC3S1400A
Type
XC3S1400A
Bank
XC3SD1800A
Type
XC3SD1800A
Bank
XC3SD3400A
Type
XC3SD3400A
Bank
FG676
Ball
G16 IP_0 0 IP_0 0 GND GND G16
G18 N.C. N.C. IP_0 0 VCCINT VCCINT G18
F9 N.C. N.C. IP_0 0 VCCAUX VCCAUX F9
F10 IP_0 0 IP_0 0 VCCINT VCCINT F10
F18 N.C. N.C. IP_0 0 VCCINT VCCINT F18
E6 N.C. N.C. IP_0 0 VCCINT VCCINT E6
E9 N.C. N.C. IP_0 0 GND GND E9
E20 IP_0 0 IP_0 0 VCCAUX VCCAUX E20
D5 N.C. N.C. IP_0 0 VCCINT VCCINT D5
D15 IP_0 0 IP_0 0 GND GND D15
D19 IP_0 0 IP_0 0 GND GND D19
C4 IP_0 0 IP_0 0 VCCINT VCCINT C4
B24 N.C. N.C. IP_0 0 GND GND B24
A5 IP_0 0 IP_0 0 GND GND A5
A7 IP_0 0 IP_0 0 VCCO_0 0 A7
A23 IP_0 0 IP_0 0 GND GND A23
A24 N.C. N.C. IP_0 0 VCCAUX VCCAUX A24
Y26 IP_L16N_1 1 IP_L16N_1 1 IP_1 1 Y26
W25 IP_L16P_1 1 IP_L16P_1 1 GND GND W25
W26 IP_L20P_1 1 IP_L20P_1 1 VCCAUX VCCAUX W26
V26 IP_L20N_1/
VREF_1
1 IP_L20N_1/
VREF_1
1 IP_1/VREF_1 1 V26
U25 IP_L24P_1 1 IP_L24P_1 1 GND GND U25
U26 IP_L24N_1/
VREF_1
1 IP_L24N_1/
VREF_1
1 IP_1/VREF_1 1 U26
H23 IP_L48P_1 1 IP_L48P_1 1 VCCAUX VCCAUX H23
H24 IP_L48N_1 1 IP_L48N_1 1 IP_1 1 H24
H25 IP_L44N_1 1 IP_L44N_1 1 VCCO_1 1 H25
H26 IP_L44P_1/
VREF_1
1 IP_L44P_1/
VREF_1
1 IP_1/VREF_1 1 H26
G25 IP_L52N_1/
VREF_1
1 IP_L52N_1/
VREF_1
1 IP_1/VREF_1 1 G25
G26 IP_L52P_1 1 IP_L52P_1 1 VCCAUX VCCAUX G26
B25 IP_L65N_1 1 IP_L65N_1 1 GND GND B25
B26 IP_L65P_1/
VREF_1
1 IP_L65P_1/
VREF_1
1 IP_1/VREF_1 1 B26