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PRODUCT PREVIEW
7MechanicalData
7.1ThermalDataforZCE
7.1.1PackagingInformation
TMS320DM355
DigitalMediaSystem-on-Chip(DMSoC)
SPRS463A–SEPTEMBER2007–REVISEDSEPTEMBER2007
Thefollowingtable(s)showthethermalresistancecharacteristicsforthePBGA–ZCEmechanical
package.Notethatmicro-viasarenotrequired.ContactyourTIrepresentativeforrouting
recommendations.
ThefollowingtableshowsthethermalresistancecharacteristicsforthePBGA–ZCEmechanical
package.
Table7-1.ThermalResistanceCharacteristics(PBGAPackage)[ZCE]
NO.μC/WAIRFLOW(m/s)
(1)
1RΘ
JC
Junction-to-caseTBDTBD
2RΘ
JB
Junction-to-boardTBDTBD
3RΘ
JA
Junction-to-freeairTBDTBD
4Psi
JT
Junction-to-packagetopTBDTBD
5Psi
JB
Junction-to-boardTBDTBD
(1)m/s=meterspersecond
Thefollowingpackaginginformationandreflectthemostcurrentdataavailableforthedesignateddevice.
Thisdataissubjecttochangewithoutnoticeandwithoutrevisionofthisdocument.Notethatmicro-vias
arenotrequiredforthispackage.
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