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8MechanicalData
8.1ThermalData
8.2PackagingInformation
TMS320C6454
Fixed-PointDigitalSignalProcessor
SPRS311A–APRIL2006–REVISEDDECEMBER2006
Table8-1showsthethermalresistancecharacteristicsforthePBGA-ZTZ/GTZmechanicalpackage.
Table8-1.ThermalResistanceCharacteristics(S-PBGAPackage)[ZTZ/GTZ]
NO.°C/WAIRFLOW
(m/s
(1)
)
1RΘ
JC
Junction-to-case1.45N/A
2RΘ
JB
Junction-to-board8.34N/A
316.10.00
413.01.0
RΘ
JA
Junction-to-freeair
511.92.0
610.73.0
0.370.00
0.891.0
7Psi
JT
Junction-to-packagetop
1.011.5
1.173.00
7.60.00
6.71.0
8Psi
JB
Junction-to-board
6.41.5
5.83.00
(1)m/s=meterspersecond
Thefollowingpackaginginformationreflectsthemostcurrentreleaseddataavailableforthedesignated
device(s).Thisdataissubjecttochangewithoutnoticeandwithoutrevisionofthisdocument.
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