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Integrator’s Reference Manual
7-20 80-99208-1 Rev. D
For hole size and locations, connector locations, and overall
envelope dimensions, see Figure 7-1 on page 7-4 and Figure
7-2 on page 7-5.
Caution
When you mount the GSP-1620 modem into an enclosure or onto a
surface, you must exercise care during the process. Adhere to the
following recommendations:
• Observe handling precautions necessary to avoid damage
by ESD.
• Fasten the modem to a planar surface of sufficient
flatness and rigidity to prevent flexing of the modem.
• Use shock mounts when the environment includes
vibration in excess of that shown in Figure 7-9 on page
7-33.
• Use acoustic dampening material when the environment
includes acoustic noise in excess of 110 dB OSPL (Overall
Sound Pressure Level).
• Do not use fasteners that will damage the grounding
areas around the through holes.
• Do not fasten the modem using tools with speed and/or
torque that will cause damage to the printed circuit
board.
• Do not fasten the modem with enough clamping force to
damage the printed circuit board.
• Exercise caution and do not damage components on the
modem during handling.
Note
The GSP-1620 modem meets or exceeds all operational vibration
requirements defined in Table 7-5 when E-A-R damping feet
(MF-100-UC04-H, black) are used as shock mounts.
QUALCOMM Mark on OEM Enclosures
Each GSP-1620 based product and its packaging shall bear
the “CDMA by QUALCOMM” mark and such other mark(s) of
QUALCOMM, or those which QUALCOMM has the right to
use and permit the use of, as QUALCOMM may designate