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Integrating GSP-1620 Modems into OEM Products
80-99208-1 Rev. D 7-31
Figure 7-8. GSP-1620 Modem Temperature/Humidity Envelope
Thermal Radiation
The temperature profile shown in Figure 7-8 includes
temperature rise due to thermal radiation, solar radiation,
and other heat loads. The GSP-1620 modem dissipates heat
that is dependent on the mode and the transmit power. The
dissipated heat is the difference between the DC input power
and the RF transmitted power.
0 5 10 20 30 40 50 60 70 80 90 95 100
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
85
90
PERCENT RELATIVE HUMIDITY
DRY BULB TEMPERATURE (degrees C)
OPERATIONAL AND NON-OPERATIONAL
ENVELOPE
NON-OPERATIONAL ONLY
CONSTANT 39.1C DEW POINT