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10–6 Thermal Management
21264/EV68A Hardware Reference Manual
Thermal Design Considerations
10.3 Thermal Design Considerations
Follow these guidelines for printed circuit board (PCB) component placement:
• Orient the 21264/EV68A on the PCB with the heat sink fins aligned with the air-
flow direction.
• Avoid preheating ambient air. Place the 21264/EV68A on the PCB so that inlet air
is not preheated by any other PCB components.
• Do not place other high power devices in the vicinity of the 21264/EV68A.
Do not restrict the airflow across the 21264/EV68A heat sink. Placement of other
devices must allow for maximum system airflow in order to maximize the performance
of the heat sink.