Compaq EV67 Network Card User Manual


 
Alpha 21264/EV67 Hardware Reference Manual
Hardware Interface 3–17
Mechanical Specifications
3.4 Mechanical Specifications
This section shows the 21264/EV67 mechanical package dimensions without a heat
sink. For heat sink information and dimensions, refer to Chapter 10.
Figure 3–2 shows the package physical dimensions without a heat sink.
Figure 3–2 Package Dimensions
1/4-20 Stud (2x)
Standoff (4x)
Lid
FM-05662.AI4
2.54 mm (.100 in) Typ
587x 1.40 mm (.055 in) Typ
1.27 mm (.050 in) Typ
27.94 mm
(1.100 in)
27.94 mm
(1.100 in)
59.94 mm (2.360 in) Typ
29.62 mm
(1.180 in) Typ
25.40 mm
(1.000 in) Typ
53.85 mm
(2.120 in) Typ
1.27 mm (.050 in) Typ
4.32 mm (.170 in) Typ
1.377 mm (.055 in) Typ
.13 mm
(.005 in) R
7.62 mm (.300 in) Typ
1.905 mm (.075 in) Typ
29.62 mm
(1.180 in) Typ
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