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Intel
®
820E Chipset
R
Design Guide 11
Table 45. USB........................................................................................................................ 134
Table 46. LAN Connect I/F..................................................................................................... 135
Table 47. AC’97 ..................................................................................................................... 136
Table 48. ICH2 Decoupling.................................................................................................... 136
Table 49. CK-SKS Clocking................................................................................................... 137
Table 50. RTC........................................................................................................................ 137
Table 51. AGTL+ Parameters for Example Calculations
1,2
.................................................... 143
Table 52. Example T
FLT_MAX
Calculations for 133 MHz Bus
1
.................................................. 144
Table 53. Example T
FLT_MIN
Calculations
1
(Frequency Independent).....................................145
Table 54. Trace Width Space Guidelines .............................................................................. 148
Table 55. Intel
®
820E Chipset Platform System Clocks......................................................... 163
Table 56. Intel
®
820E Chipset Platform Clock Skews............................................................ 165
Table 57. Intel
®
820E Chipset Platform System Clock Cross-Reference .............................. 167
Table 58. Placement Guidelines for Motherboard Routing Lengths (Direct RDRAM*
Clock Routing Length Guidelines) .......................................................................... 170
Table 59. External DRCG Component Values.......................................................................172
Table 60. Unused Output Termination................................................................................... 174
Table 61. 28 Ω Stack-Up Examples....................................................................................... 179
Table 62. 3D Field Solver vs. ZCALC .................................................................................... 180
Table 63. Intel
®
820E Chipset Component Thermal Design Power....................................... 193
Table 64. Glue Chip Vendors................................................................................................. 194