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Intel
®
820E Chipset
R
Design Guide 5
2.22.
LAN Layout Guidelines................................................................................................ 102
2.22.1. ICH2 – LAN Interconnect Guidelines ........................................................ 103
2.22.1.1. Bus Topologies............................................................................. 104
2.22.1.2. Point-to-Point Interconnect ........................................................... 104
2.22.1.3. LOM/CNR Interconnect ................................................................ 104
2.22.1.4. Signal Routing and Layout............................................................ 105
2.22.1.5. Crosstalk Consideration ............................................................... 106
2.22.1.6. Impedances.................................................................................. 106
2.22.1.7. Line Termination........................................................................... 106
2.22.2. General LAN Routing Guidelines and Considerations .............................. 107
2.22.2.1. General Trace Routing Considerations ........................................ 107
2.22.2.1.1. Trace Geometry and Length....................................... 108
2.22.2.1.2. Signal Isolation ........................................................... 108
2.22.2.2. Power and Ground Connections .................................................. 108
2.22.2.2.1. General Power and Ground Plane Considerations .... 108
2.22.2.3. 4-Layer Board Design................................................................... 110
2.22.3. Intel
®
82562EH Home/PNA* Guidelines ................................................... 112
2.22.3.1. Power and Ground Connections .................................................. 112
2.22.3.2. Guidelines for Intel
®
82562EH Component Placement ................ 112
2.22.3.3. Crystals and Oscillators................................................................ 112
2.22.3.4. Phoneline HPNA Termination....................................................... 113
2.22.3.5. Critical Dimensions....................................................................... 114
2.22.3.5.1. Distance from Magnetics Module to Line RJ11.......... 114
2.22.3.5.2. Distance from Intel
®
82562EH Component to
Magnetics Module ...................................................... 114
2.22.3.5.3. Distance from LPF to Phone RJ11............................. 115
2.22.4. Intel
®
82562ET / Intel
®
82562EM Component Guidelines......................... 115
2.22.4.1. Guidelines for Intel
®
82562ET / Intel
®
82562EM Component
Placement .................................................................................... 115
2.22.4.2. Crystals and Oscillators................................................................ 116
2.22.4.3. Intel
®
82562ET / Intel
®
82562EM Component Termination
Resistors .................................................................................... 116
2.22.4.4. Critical Dimensions....................................................................... 116
2.22.4.4.1. Distance from Magnetics Module to RJ45.................. 117
2.22.4.4.2. Distance from the Intel
®
82562ET Component to the
Magnetics Module ...................................................... 118
2.22.4.5. Reducing Circuit Inductance......................................................... 118
2.22.4.6. Terminating Unused Connections ................................................ 118
2.22.4.6.1. Termination Plane Capacitance ................................. 118
2.22.5. Intel
®
82562ET/EM Disable Guidelines ....................................................... 119
2.22.6. Intel
®
82562ET and Intel
®
82562EH Components’ Dual-Footprint
Guidelines.................................................................................................... 120
2.22.7. ICH2 Decoupling Recommendations........................................................ 122
2.23. FWH Flash BIOS Guidelines....................................................................................... 124
2.23.1. In-Circuit FWH Flash BIOS Programming ................................................ 124
2.23.2. FWH Flash BIOS VPP Design Guidelines ................................................ 124
2.24. ICH2 Design Checklist ................................................................................................ 125
2.25. ICH2 Layout Checklist................................................................................................. 134
3. Advanced System Bus Design................................................................................................. 139
3.1. Terminology and Definitions........................................................................................ 139
3.2. AGTL+ Design Guidelines........................................................................................... 141
3.2.1. Initial Timing Analysis................................................................................ 142
3.2.2. Determine the Desired General Topology, Layout, and Routing............... 145