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LAN
25V
20%
0.1UF
C387C388
0.1UF
20%
25V25V
20%
0.1UF
C389C390
0.1UF
20%
25V
25V
20%
0.1UF
C384C385
0.1UF
20%
25V
25V
20%
0.1UF
C380 C381
0.1UF
20%
25V 25V
20%
0.1UF
C382 C383
0.1UF
20%
25V
C378
0.1UF
20%
25V25V
20%
0.1UF
C377
C375
4.7UF
20%
16V16V
20%
4.7UF
C370
16V
20%
4.7UF
C366
C376
0.1UF
20%
25V 25V
20%
0.1UF
C379
C369
4.7UF
20%
16V
25V
20%
0.1UF
C386
VCC3_3SBY
DRAWN BY:
LAST REVISED: SHEET:
FOLSOM, CALIFORNIA 95630
1900 PRAIRIE CITY ROAD
87654321
A
B
C
D
12345678
D
C
B
A
PCG PLATFORM DESIGN
REV:
0.5
PROJECT:
OF 40
TITLE: INTEL(R) 820E CHIPSET 2 DIMM FCPGA REFERENCE BOARD
R
PCG AE Camino2
VCC3_3SBY
2: Include at least 0.1uf cap per EEPROM
LAN
STUFF FOR 82562EH
STUFF FOR GILAD ONLY
1: Bulk Caps (4.7uf) should be palced 1 per side around
Kennereth/+ and 0.1uf caps should be placed near PWR/GND
and high speed signals.
NOTES:
STUFF FOR 82562ET/EM ONLYAND 82562ET/EM