AMD LX 900@1.5W Computer Hardware User Manual


 
12 AMD Geode™ LX Processors Data Book
Overview
33234H
1.2 Features
General Features
Functional blocks include:
—CPU Core
GeodeLink™ Control Processor
GeodeLink Interface Units
GeodeLink Memory Controller
Graphics Processor
Display Controller
Video Processor
TFT Controller/Video Output Port
Video Input Port
GeodeLink PCI Bridge
Security Block
0.13 micron process
Packaging:
481-Terminal BGU (Ball Grid Array Cavity Up) with
internal heatspreader
Single packaging option supports all features
Industrial temperature range available for the
LX 800@0.9W processor*
CPU Processor Features
x86/x87-compatible CPU core
Performance:
Processor frequency: up to 600 MHz
Dhrystone 2.1 MIPs: 150 to 450
Fully pipelined FPU
Split I/D cache/TLB (Translation Look-aside Buffer):
64 KB I-cache/64 KB D-cache
128 KB L2 cache configurable as I-cache, D-cache,
or both
Efficient prefetch and branch prediction
Integrated FPU that supports the MMX™ and
AMD 3DNow!™ instruction sets
Fully pipelined single precision FPU hardware with
microcode support for higher precisions
GeodeLink™ Control Processor
JTAG interface:
ATPG, Full Scan, BIST on all arrays
1149.1 Boundary Scan compliant
ICE (in-circuit emulator) interface
Reset and clock control
Designed for improved software debug methods and
performance analysis
Power Management:
LX 900@1.5W processor* (Unterminated):
Total Dissipated Power (TDP) 5.1W,
2.6W typical @ 600 MHz max power
LX 800@0.9W processor* (Unterminated):
Total Dissipated Power (TDP) 3.6W,
1.8W typical @ 500 MHz max power
LX 700@0.8W processor* (Unterminated):
Total Dissipated Power (TDP) 3.1W,
1.3W typical @ 433 MHz max power
LX 600@0.7W processor* (Unterminated):
Total Dissipated Power (TDP) 2.8W,
1.2W typical @ 366 MHz max power
GeodeLink active hardware power management
Hardware support for standard ACPI software power
management
I/O companion SUSP/SUSPA power controls
Lower power I/O
Wakeup on SMI/INTR
Works in conjunction with the AMD Geode™ CS5536
(USB 2.0) or CS5535 (USB 1.1) companion device
GeodeLink™ Architecture
High bandwidth packetized uni-directional bus for
internal peripherals
Standardized protocol to allow variants of products to be
developed by adding or removing modules
GeodeLink Control Processor (GLCP) for diagnostics
and scan control
Dual GeodeLink Interface Units (GLIUs) for device inter-
connect
GeodeLink™ Memory Controller
Integrated memory controller for low latency to CPU and
on-chip peripherals
64-bit wide DDR SDRAM bus operating frequency:
200 MHz, 400 MT/S
Supports unbuffered DDR DIMMS using up to 2 GB
DRAM technology
Supports up to 2 DIMMS (16 devices max)
2D Graphics Processor
High performance 2D graphics controller
Alpha BLT
Windows
®
GDI GUI acceleration:
Hardware support for all Microsoft RDP codes
Command buffer interface for asynchronous BLTs
Second pattern channel support
Hardware screen rotation
*The AMD Geode LX 900@1.5W processor operates at 600 MHz, the AMD Geode LX 800@0.9W processor operates at 500 MHz, the
AMD Geode LX 700@0.8W processor operates at 433 MHz and the AMD Geode LX 600@.07W processor operates at 366 MHz. Model
numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark
.