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1.1ZTZ/GTZBGAPackage(BottomView)
ZTZ/GTZ 697-PIN BALL GRID ARRAY (BGA) PACKAGE
(BOTTOM VIEW)
A
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NOTE: The ZTZ mechanical package designator represents the version of the GTZ package with lead-free balls. For more detailed information,
see the Mechanical Data section of this document.
1.2Description
SM320C6455-EP
FIXED-POINTDIGITALSIGNALPROCESSOR
SPRS462B–SEPTEMBER2007–REVISEDJANUARY2008
•SystemPLLandPLLControllerBoundary-Scan-Compatible
•SecondaryPLLandPLLController,Dedicated•697-PinBallGridArray(BGA)Package
toEMACandDDR2MemoryController(ZTZorGTZSuffix),0.8mmBallPitch
•AdvancedEventTriggering(AET)Compatible•0.09µm/7-LevelCuMetalProcess(CMOS)
•Trace-EnabledDevice•3.3/1.8/1.5/1.25/1.2VI/Os,1.25/1.2VInternal
•IEEE-1149.1(JTAG™)
Figure1-1showstheSM320C6455-EPdevice697-pinballgridarraypackage(bottomview).
Figure1-1.ZTZ/GTZBGAPackage(BottomView)
TheC64x+™DSPs(includingtheSM320C6455-EPdevice)arethehighest-performancefixed-pointDSP
generationintheC6000™DSPplatform.TheC6455deviceisbasedonthethird-generation
high-performance,advancedVelociTI™very-long-instruction-word(VLIW)architecturedevelopedby
TexasInstruments(TI),makingtheseDSPsanexcellentchoiceforapplicationsincludingvideoand
telecominfrastructure,imaging/medical,andwirelessinfrastructure(WI).TheC64x+™devicesare
upwardcode-compatiblefrompreviousdevicesthatarepartoftheC6000™DSPplatform.
Basedon90-nmprocesstechnologyandwithperformanceofupto9600millioninstructionspersecond
(MIPS)[or960016bitMMACspercycle]ata1.2-GHzclockrate,theC6455deviceofferscost-effective
solutionstohigh-performanceDSPprogrammingchallenges.TheC6455DSPpossessestheoperational
flexibilityofhigh-speedcontrollersandthenumericalcapabilityofarrayprocessors.
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