Filter
Top Products
IXF1104 4-Port Gigabit Ethernet Media Access Controller
Datasheet 223
Document Number: 278757
Revision Number: 007
Revision Date: March 25, 2004
9.0 Mechanical Specifications
The IXF1104 is packaged in a 576-ball BGA package with 6 balls removed diagonally from each
corner, for a total of 552 balls used measuring 25 mm x 25 mm. The pitch of the balls on the
package is 1 mm.
9.1 Overview
CBGA packages are suited for applications requiring high I/O counts and high electrical
performance. They are recommended for high-power applications with high noise immunity
requirements.
9.1.1 Features
• Flip chip die attach; surface mount second-level interconnect
• High electrical performance
• High I/O counts
• Area array I/O options
• Multiple power-zone offering supports core and four additional voltages
• JEDEC-compliant package
9.2 Package Specifics for the IXF1104
The IXF1104 uses the following package:
• 576-ball BGA package with 6 balls removed diagonally from each corner, for a total of 552
balls used
• Ball pitch of 1.0 mm
• Overall package dimensions of 25 mm x 25 mm