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APPENDIX A DIFFERENCES BETWEEN
µ
PD78078, 78075B SUBSERIES, AND
µ
PD78070A
The major differences between the
µ
PD78078, 78075B Subseries, and
µ
PD78070A are shown in Table A-1.
Table A-1. Major Differences between
µ
PD78078, 78075B Subseries, and
µ
PD78070A
Part Number
µ
PD78078 Subseries
µ
PD78075B Subseries
µ
PD78070A
Item
Anti-EMI noise measure Not provided Provided Not provided
Product equipped with I
2
C bus Available Not available Available
Supply voltage VDD = 1.8 to 5.5 V VDD = 2.7 to 5.5 V
Internal ROM size
µ
PD78076 : 48 Kbytes
µ
PD78074B : 32 Kbytes Not provided
µ
PD78078, 78P078
µ
PD78075B : 40 Kbytes
: 60 Kbytes
Internal expansion RAM size 1024 bytes None
I/O port Total 88 61
CMOS input 2
CMOS I/O 78 51
N-ch open-drain I/O 8
Pins
with
Note
1
Pin with pull-up resistor
86 (78 for
µ
PD78P078) 51
additional
Medium-voltage pin 8 Not provided
functions
LED direct drive output
16 Not provided 4
AVDD pin Provided Not provided Provided
(AV
REF0
pin functions alternately)
External Bus mode Selectable from multiplexed bus mode or separate Only separate bus mode
expansion bus mode
function
Memory expansion mode
Selectable from four types of memory expansion modes
Only full-address mode
ROM correction function Provided Not provided
Package •100-pin plastic QFP • 100-pin plastic QFP • 100-pin plastic QFP
(Fine pitch) (14 x 14 mm)
Note 2
(Fine pitch) (14 x 14 mm) (Fine pitch) (14 x 14 mm)
•100-pin plastic LQFP •100-pin plastic LQFP •100-pin plastic LQFP
(Fine pitch) (14 x 14 mm) (Fine pitch) (14 x 14 mm)
(Fine pitch) (14 x 14 mm)
Note 4
•100-pin plastic QFP •100-pin plastic QFP • 100-pin plastic QFP
(14 x 20 mm) (14 x 20 mm) (14 x 20 mm)
•
100-pin ceramic WQFN
Note 3
Electrical specifications Refer to the data sheet of individual product.
Recommended soldering conditions
Notes 1. The number of I/O ports includes the pins with additional functions.
2. Not available in the Y subseries
3. PROM version only
4. Under development