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6-2 Electrical Specifications
Table 6.1 Absolute Maximum Stress Ratings
1
1. Stresses beyond those listed above may cause permanent damage to the device. These are stress
ratings only; functional operation of the device at these or any other conditions beyond those
indicatedintheOperating Conditions section of the manual is not implied.
Symbol Parameter Min Max Unit Test Conditions
T
STG
Storage temperature −55 150 °C–
V
DD
Supply voltage −0.5 4.5 V –
V
IN
Input voltage V
SS
−0.3 5.55 V SCSI 5 V TolerANT pads
I
LP
2
2. −2V<V
PIN
<8V.
Latch-up current ±=150 – mA –
ESD Electrostatic discharge – 2 K V MIL-STD 883C,
Method 3015.7
Table 6.2 Operating Conditions
1
1. Conditions that exceed the operating limits may cause the device to function incorrectly.
Symbol Parameter Min Max Unit Test Conditions
V
DD
Supply voltage 2.97 3.63 V ±10%
I
DD
Supply current (dynamic)
Supply current (static)
–
–
200 mA
1mA
mA
mA
–
–
T
A
Operating free air 0 70 °C–
θ
JA
Thermal resistance
(junction to ambient air)
– 25.1
34.7
°C/W 160 PQFP
169 PBGA
Table 6.3 Input Capacitance
Symbol Parameter Min Max Unit Test Conditions
C
I
Input capacitance of input pads – 7 pF –
C
IO
Input capacitance of I/O pads – 15 pF –