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SA-1100 Developer’s Manual 14-3
Package and Pinout
14.2 Mini-Ball Grid Array – (mBGA)
Figure 14-2 shows the SA-1100 256 mini-ball grid array (mBGA) mechanical drawing.
Table 14-2 lists the SA-1100 pins in numeric order, showing the signal type for each pin.
Figure 14-2. SA-1100 256 Mini-Ball Grid Array Mechanical Drawing
A6843-01
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE
AND ITS CONTENTS MAY NOT BE DISCLOSED WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION !.
1. ALL DIMENSIONS AND TOLERANCES CONFORM
TO ANSI Y14.5M —1982.
2. DIMENSION IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM
3. PRIMARY DATUM AND SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
4. ALL DIMENSIONS UNLESS OTHERWISE SPECIFIED
ARE IN MILLIMETERS
– C –
– C –
NOTES:
PIN #1 CORNER
PIN #1
CORNER
A
B
13
2
5
4
7
6
9
8
11
10
13
12
740160
01 ENGINEERING RELEASE 02/22/99
DWG. NO.
X ±0.1
XX ±0.05
XXX ±0.030
±1
˚
UNLESS OTHERWISE SPECIFIED
A. ESCIO
D
A
B
C
D
A
B
C
D
1345678
12345678
34649 740160 01
8/1
SHEET 1 OF 1
256L PBGA CUSTOMER DRAWING
17.00 x 17.00 x 0.36
02/22/99
02/22/99
L. PELCHAT
DIMENSIONS ARE IN MILLIMETERS
TOLERANCE
DECIMALS
MATERIAL
FINISH
SIZE
CORP.
5000 W. CHANDLER BLVD.
CHANDLER, ARIZONA 85226
SCALE
FSCM NO. DRAWING NO. REV
APVD BY
APVD BY
CHK B
DWN BY
DSGN BY
DATE
DATE
DATE
DATE
DATE
ANGLES
ZONE REV DESCRIPTION DATE APPROVED
PREVIOUS
SH REV
15
1416
C
D
E
F
G
H
J
K
L
M
N
P
R
T
12.00 REF
12.00 REF
1.00 REF
15.00 ±0.25
15.00 ±0.25
0.80 ±0.05
0.40 ±0.10
0.36 ±0.04
1.56 ±0.19
17.00 ±0.20
17.00 ±0.20
–A–
–B–
¤
¢
¢
–C–
//
A0.127
//
C
0.15
0.15
A0.127
0.30
AB
0.60
0.40
1.00
1.00
1.00 REF
C
S
PIN #1 I.D.
1.0 DIA
45
˚
CHAMFER
4 PLACES
¢ 1.0
3 PLACES
30
˚
3
SEATING PLANE
T
2
SS
BOTTOM VIEW
256 SOLDER BALLS
TOP VIEW
SIDE VIEW