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9 PACKAGE
S1C33L03 PRODUCT PART EPSON A-109
A-1
A-9
9 Package
9.1 Plastic Package
QFP20-144pin
(Unit: mm)
20
±0.1
22
±0.4
73108
20
±0.1
22
±0.4
37
72
INDEX
0.2
361
144
109
1.4
±0.1
0.1
1.7
max
1
0.5
±0.2
0°
10°
0.125
0.5
+0.1
–0.05
+0.05
–0.025
Limit of power consumption
The chip temperature of an LSI rises according to power consumption. The chip temperature can be
calculated from environment temperature (Ta), thermal package resistance (θ) and power consumption (P
D).
Chip temperature (Tj) = Ta + (P
D × θ) (°C)
As a guide, normally keep the chip temperature (Tj) lower than 85°C.
The thermal resistance of the QFP20-144pin package is as follows:
Thermal resistance (°C/W) = 110 to 120°C (90 to 100°C for Cu lead frame)
This thermal resistance is a value under the condition that the measured device is hanging in the air and has
no air-cooling. Thermal resistance greatly varies according to the mounting condition on the board and air-
cooling condition.