www.digiembedded.com
845
Packaging
Product specifications
These tables provide additional information about the NS9750.
ROHS substance PPM level
Lead 0
Mercury 0
Cadmium 0
Hexavalent Chromium 0
Polybrominated biphenyls 0
Polybrominated diphenyl ethers 0
Table 484: NS9750 ROHS specifications
Component Weight [mg] Material Weight [mg] Weight [%]
CAS no. Name
Chip 27.037 7440-21-3 Si 27.0370 0.61
Frame 1841.616 223769-10-6 Epoxy resin 865.5600 19.71
7440-50-8 Cu 736.6500 16.77
7440-02-0 Ni 9.2100 0.21
7440-57-5 Au 1.8400 0.04
Other 228.3560 5.20
Bonding wire 6.990 7440-57-5 Au 6.9900 0.16
Ag paste 3.400 7440-22-4 Ag 2.6200 0.06
Epoxy, other 0.7800 0.02
Epoxy resin 1920.177 60676-86-0 Silica (SiO2) 1747.3570 39.79
Epoxy, other 86.4100 1.97
Phenol Resin 86.4100 1.97
Table 485: NS9750 materials sheet