Lucent Technologies R5SI Computer Hardware User Manual


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DEFINITY Enterprise Communications Server Release 5
Maintenance and Test for R5vs/si
555-230-123
Issue 1
April 1997
Maintenance Object Repair Procedures
Page 10-1375TAPE (Tape Unit) [G3iV1.1-286]
10
If any test failed, proceed to Step 9.
9. Replace the TN773 Processor circuit pack.
Power down the system.
Reinsert the original TN770 Memory circuit pack.
Replace the TN773 Processor circuit pack.
Power up the system.
If the system boots up with the customer’s translations, enter the
test tape long repeat 3 command.
If all tests pass:
The problem was a defective TN773 Processor circuit pack. The TN770
Memory circuit pack is working fine.
If any test failed or if the system cannot be brought back into service
successfully, proceed to Step 10.
10. Replace the TN770 Memory circuit pack. Use both the new Memory circuit
pack and the new Processor circuit pack.
Power down the system.
Replace the TN770 Memory circuit pack.
Power up the system.
If the system comes up with the customer’s translations, issue the
test tape long repeat 3 command.
If all tests pass:
The problem was a defective Memory circuit pack and a defective
Processor circuit pack.
If any test still fails, escalate the problem.
For High or Critical Reliability Systems
NOTE:
Before performing the following repair procedures, refer to the ‘‘Circuit
Pack Replacement Procedure’’ section in Chapter 6, ‘‘Reliability Systems: A
Maintenance Aid’’ for instructions on how to replace a circuit pack in a High
or Critical Reliability System.
Make sure that the SPE that has the alarmed tape/tape drive is the Standby
SPE before replacing the Processor circuit pack or the Memory circuit pack.
11. Replace the TN770 Memory circuit pack on the STANDBY control carrier.
Replace the TN770 Memory circuit pack (see the previous Note).
Test the tape in the Standby control carrier by issuing the test tape
[a|b] long repeat 3 command, where "[a|b]" is the Standby control
carrier.