Lucent Technologies R5SI Computer Hardware User Manual


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DEFINITY Enterprise Communications Server Release 5
Maintenance and Test for R5vs/si
555-230-123
Issue 1
April 1997
Maintenance Object Repair Procedures
Page 10-1392TDM-BUS (TDM Bus)
10
If any of the TDM Bus tests fail, the re-inserted circuit pack is faulty.
Replace the circuit pack and do this procedure again for the new
circuit pack.
If none of the TDM Bus tests fail, then the problem has been fixed.
Procedure 3
This procedure removes and re-inserts control carrier circuit packs one at a time.
The Network Control circuit pack and the Processor Interface circuit pack are the
only processor complex circuit packs that communicate on the TDM Bus, and
thus are the only processor complex circuit packs likely to cause a TDM Bus
problem in a stable system. This procedure should be performed for the
Processor Interface circuit pack before it is attempted for any other processor
complex circuit packs.
In a System Without High or Critical Reliability
To perform this procedure for the Network Control circuit pack, this circuit pack
must be replaced. The system cannot operate without the Network Control circuit
pack.
1. Power down the control carrier.
2. Remove the suspected circuit pack.
3. Check if the backplane pins in the removed circuit pack’s slot appear to
be bent.
4. If the backplane pins are bent:
Straighten or replace the pins.
Insert the same circuit pack.
Repeat from Step 2 with the same circuit pack.
5. If the backplane pins are not bent, insert or replace the circuit pack.
6. Turn the power back on to reboot the system.
7. Run the test tdm P command.
8. If any of the TDM Bus tests fail:
If the circuit pack in Step 5 was inserted, do this step again
replacing the circuit pack.
If the circuit pack in Step 5 was replaced, do this step again with
the next circuit pack.
9. If none of the TDM Bus tests fail, the problem has been fixed.
10. If this step fails to identify the cause of the problem, go to Procedure 4.